As a representative of the current advanced visual inspection methods, 3D visual inspection has played an important role in optimizing process, controlling yield, improving efficiency and reducing cost in various manufacturing lines in recent years. The stability of product quality in semiconductor chip industry is very important to users. Front channel quantity inspection and rear channel inspection have been integrated into its whole production process. Due to the small size of semiconductor products, the precision and accuracy of front channel inspection are required to be higher in the production process, which are exactly the advantages of 3D vision detection technology. Therefore, we believe that 3D visual inspection will play an irreplaceable role in the whole process of semiconductor manufacturing.
This issue sorted out the recent applications of Sizector® 3D camera in the field of semiconductor chip inspection. You can see that multiple models of Sizector® 3D cameras are outstanding in terms of point cloud quality, 3D data acquisition speed and object compatibility.
Standard FOV 60mm*45.5mm; 5328 pixels in X-axis; Resolution(Mega Pixels) 16 .2M; FPS of whole cycle time ≤3.9; PPS of whole cycle time 63.18M
Standard FOV 40mm*30mm； Repeatability Z （1σ）（um）*1 ≤1μm； Resolution(Mega Pixels) 320M； FPS of whole cycle time ≤2.1FPS
Standard FOV 20mm*15mm ；Repeatability Z （1σ）（um）*1 ≤1μm； Resolution(Mega Pixels) 320M； FPS of whole cycle time ≤2.1FPS
Standard FOV 60mm*45.5mm; 5328 pixels in X-axis; Resolution(Mega Pixels) 16 .2M; FPS of whole cycle time ≤3.9; PPS of whole cycle time 63.18M
