Sizector®3D Camera SX Series
Optical inspection plays a pivotal role in the field of BGA packaging and testing, constituting an indispensable part of the semiconductor chip production process. It is commonly involved in stages such as wafer inspection, inspection of particulate surface defects, inspection of chip placement/lead bonding, and SMT inspection. Users can sort chips based on the inspection results. The Sizector® 3D camera SX series, based on multi-projection structured light and hardware computation imaging technology, provides high-quality 3D point clouds for inspection in Molding, electroplating, BGA Balls, Leads, or 3D measurements, offering effective data support for process control and quality management, thereby enhancing production efficiency.
BGA (Ball Grid Array): Width, height, coplanarity, spacing, missing balls, etc.
Encapsulation: Defects, scratches, cracks, etc.
Product Recommendation
Sizector®3D Camera SX Series
Model
SQ081017
8.1M px(2856x2848)
4
17.7X17.7mm
Reference Distance
115mm
±2mm
1.4FPS@8.1M 4.8FPS@2.03M
<0.1µm
Multi-projection technology is used to capture multiple groups of 3D point clouds from different projection directions for hardware fusion, which has higher integrity.
After multi-3D fusion on the camera hardware, high-precision 3D point clouds output directly. Compared with PC-based system, the transmission data volume is sharply reduced, and the computation time is not increased.
Using telecentric lens, 2D and 3D data could be alignment on pixel level and external light source synchronization to achieve 2D+3D one-stop measurement and inspection. With external RGB light, users can obtain high-resolution 3D data and high-precision 3CCD true color images without Bayer matrix.
